PCB Assembly Equipment
Min. Order Quantity: NO
Supply Ability: 30~50thousand ㎡/Month
Payment Terms: T/T, Paypal, WU, etc.
With more than 10 years of PCB manufacturing experience, KingSong provides high-reliability products and provides our customers with high-value, high-quality, and guaranteed quality production services.
|PCB Assembly Equipment|
|Solder mask color||Green (can be customized)|
|Component labeling color||White (can be customized)|
|Surface Finishing||HASL-Lead Free|
|Service type||Full assembled services|
|Test||E-test, AOI, X-ray, Function test|
|Assembly Tech||DIP and Wave Soldering, SMT and Reflow Soldering|
|Single and double sided SMT/PTH||Yes|
|Large parts on both sides, BGA on both sides||Yes|
|Smallest Chips size||0201|
|Min BGA and Micro BGA pitch and ball counts||0.008 in. (0.2mm) pitch, ball count greater than 1000|
|Min Leaded parts pitch||0.008 in. (0.2 mm)|
|Max Parts size assembly by machine||2.2 in. x 2.2 in. x 0.6 in.|
|Assembly surface mount connectors||Yes|
|Odd form parts:
Resistor and capacitor networks
Variable resistors and capacitors (pots)
|Yes, Assembly by hands|
|Max PCB size||14.5 in. x 19.5 in.|
|Min PCB Thickness||0.02 in.|
|Fiducial Marks||Preferred but not required|
|PCB Finish||SMOBC/HASL, Electrolytic gold, Electroless gold, Electroless silver, Immersion gold, Immersion tin, OSP|
|Panelized PCB||Tab routed, Breakaway tabs, V-Scored, Routed + V-scored|
|Inspection||AOI, X-ray analysis, Microscope to 20X, Function test|
|Rework||BGA removal and replacement station
SMT IR rework station
Thru-hole rework station
PCB Assembly Prototype (Sample): 7-10 working days,
Mass PCB Assembly Production: 15-20 working days.
The inner vacuum packing or anti-static bag, Outer standard carton box packing.
1. By DHL, UPS, FedEx, TNT, etc.
2. By sea for mass quantity according to the customer’s requirement.
If you need a quotation for your PCB projects, please provide the following info:
1. Quote, quantity.
2. Gerber file in a 274-x format, and Bom List.
3. Manufacturing requirements or parameters (material, layer, copper thickness, board thickness, surface finishing, solder mask/silkscreen color…).
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