Automated X-Ray Inspection


Automated X-Ray Inspection

Automated X-Ray Inspection is similar to Automated AOI Inspection,as a new type technology be used to test the assembly,Automated X-Ray Inspection use low-energy X-rays for rapid detection without damaging the items being inspected.

Using high-voltage impact targets to generate X-ray penetration to detect the internal structural quality of electronic components, semiconductor package products, and the quality of solder joints of various types of SMT.

Application range:IC, BGA, PCB,PCBA, surface mount process solder ability testing, etc.

Testing items:
1.integrated circuit packaging process inspection
2.printed circuit board manufacturing process inspection
3.surface mount process solder ability testing
4.connection line inspection
5.tin ball array packaging and chip packaging integrity inspection
6.inspection of high-density plastic or metal materials
7.chip size measurement, line arc measurement, component tin eating area ratio measurement

With the development of high-density packaging technology, it also brings new challenges to testing technology. In response to new challenges, many new technologies are constantly emerging. X-ray detection technology is a very important way. The X-ray inspection can effectively control the welding and assembly quality of the BGA. Today’s X-ray inspection systems are not only used in laboratory analysis, but have been used exclusively in many industries for production. The PCB industry is one of them. To some extent, X-ray inspection technology is a necessary means to ensure the quality of electronic assembly.

In terms of the PCB industry, BGA testing is becoming more and more important. In order to ensure the quality of invisible solder joints during PCB assembly of such devices, X-ray inspection is an indispensable tool. This is because X-ray inspection technology can directly penetrate the inside of the package to directly detect the quality of the solder joint. Since the packaging methods of current semiconductor product components are becoming smaller and smaller, this requires a better X-ray inspection instrument to ensure the miniaturization detection of product components.

X-ray detects high-resolution X-ray images with the ability to analyze defects such as open circuits, short circuits, solder joint holes, and more. Not only that, the -ray detector has enough magnification to make it easy for producers to see detailed product defects to meet quality requirements.

The IC chip is the core of electronic products, and its importance is self-evident. In order to ensure the quality and good soldering of IC chips, X-RAY testing equipment is often used as the mainstream testing equipment.

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